There are many. The Dayton Process BV is the only FIC process that uses Teflon as a source of the fluoride ion. This is much safer to handle than the gaseous hydrogen fluoride used in other systems. Gaseous systems must usually be installed in enclosed rooms to minimize the risk of an HF leak and require more preventive maintenance. Unlike gaseous processes, the Dayton Process BV doesn’t require pulsing of gas to create effective cleaning so it is much simpler to operate and cycle times are shorter. Furthermore, the Dayton Process BV involves very dry chemical reactions so there is little risk of intergranular attack. Gaseous processes involve reactions that create moisture thereby increasing the risk of intergranular attack.
For more information please visit our Fluoride Ion Cleaning page